Latest Non-contact Ultrasonic Assisted Device For Hard Material On CNC Machine
Home » Products » Ultrasonic machining system » Latest Non-contact Ultrasonic Assisted Device For Hard Material On CNC Machine

loading

Share to:
facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
sharethis sharing button

Latest Non-contact Ultrasonic Assisted Device For Hard Material On CNC Machine

Frequency: 20kHz Power: 500W Spindle Mode: BT Series/ISO Series/ HSK Series Amplitude: More than 10um Warranty: One Year Lead Time: 30days Min Order: 1PCS
Availability:
Quantity:
  • SP-AM20

  • SP

  • 8543709990

Description: 

Ultrasonic assisted system

Ultrasonic vibration assisted machining (UVA) is a process that uses micro-high frequency vibration to be applied to cutting tools to improve material removal efficiency. The principle is to make the interaction between the tool and the workpiece a microscopically non-monotonous process to promote chip separation and reduce processing force. It can also reduce the deformation area in the workpiece being machined, thereby improving the surface integrity of the machined part. There are several types of UVA processing methods, the difference lies in the direction of vibration introduced relative to the cutting direction. The application of UVA processing on various workpiece materials shows that this process can significantly improve the processing performance. The key aspects of ultrasonic vibration assisted machining are cutting kinematics and dynamics, the influence of workpiece materials, and the wear of cutting tools. The range of suitable products for ultrasonic vibration assisted processing covers a wide range of workpiece materials, including metal alloys, ceramics, and amorphous materials and composite materials.


Introduction Of Non-contact Ultrasonic Assisted System: 

Ultrasonic assisted system

Ultrasonic assisted system is a new technology of processing method which could enhance the milling and drilling performance through high frequency micro vibrations. Ultrasonic assisted system is constituted of 3 parts: ultrasonic generator, ultrasonic transducer and ultrasonic horn.

Through the ultrasonic digital generator, the ultrasonic tool holder can produce continuous high-intensity vibration impact of 20KHZ-50KHZ (ultrasonic frequency), which drives the tool (turning tool, milling tool, touch) to impact the workpiece. So that the local stress of the workpiece far exceeds the limit of brittle fracture of the material, so that the material is locally broken and removed.

The introduction of ultrasonic vibration changes the time-space relationship, contact state and action mechanism between the tool and the workpiece, thus changing the machining mechanism.

The introduction of ultrasonic vibration can reduce the friction between the tool and the workpiece, reduce the contact time between the tool and the workpiece, so as to effectively improve the material removal rate, reduce the cutting force, reduce the cutting heat, reduce the tool wear, and improve the machining accuracy and quality.


Specification:

Working frequency

20 KHz

Power

500w

Product mode 

BT/ ISO/ HSK/ CAT series drilling machine handle

Amplitude

10um or more(adjustable)

Speed

20000 r/min

Matching tool

Carbide drilling head Φ2-Φ10mm


Display Of Non-contact Ultrasonic Assisted Device Working Efforts: 


Application: 

Ultrasonic machining

Ultrasonic machining is mainly used for drilling (including round holes, special-shaped holes and curved holes) of various hard and brittle materials, such as glass, quartz, ceramics, silicon, germanium, ferrite, gemstones and jade, cutting, slotting, nesting, engraving, deburring of batch small parts, polishing of mold surface and grinding wheel dressing.

Corundum abrasive is used for ultrasonic processing of plastic materials, silicon carbide abrasive is used for brittle materials, boron carbide abrasive is used for processing of cemented carbide, and diamond powder abrasive is used for processing of diamond. Therefore, it is widely used in high-end electronic products, such as smart phones, tablet computers, smart TVs, handheld devices and liquid crystal displays (LCD).


Advantage: 

1. Facilitate the discovery of new substances.

2. Will not change the chemical structure of the multi-mentioned ingredients.

3. Do not use or use less extractant to reduce the pollution of extractant.

4. The technology is simple, which can increase the production speed, reduce the production cost of the enterprise, and increase the economic effect.

shipping-10

FAQ

Previous: 
Next: 

Related Products

QUICK LINKS

NEED HELP

Address: No.30 DATANG VILLAGE FUYANG DISTRICT HANGZHOU CITY ZHEJIANG PROVINCE CHINA

Email: info@shengpaigroup.com

Tel: 0086-571-63127797

Mobile: 0086-15888033040

              0086-15355441892

 

Contact Us >

Placeholder Image

    NEWSLETTER

Signup to be the first to know about discounts and new product releases.

Hangzhou Shengpai Technology Co.,Ltd © 2020 - ALL RIGHTS RESERVED