Ultrasonic vibration assisted machining (UVA) is a process that uses micro-high frequency vibration to be applied to cutting tools to improve material removal efficiency. The principle is to make the interaction between the tool and the workpiece a microscopically non-monotonous process to promote chip separation and reduce processing force. It can also reduce the deformation area in the workpiece being machined, thereby improving the surface integrity of the machined part. There are several types of UVA processing methods, the difference lies in the direction of vibration introduced relative to the cutting direction. The application of UVA processing on various workpiece materials shows that this process can significantly improve the processing performance. The key aspects of ultrasonic vibration assisted machining are cutting kinematics and dynamics, the influence of workpiece materials, and the wear of cutting tools. The range of suitable products for ultrasonic vibration assisted processing covers a wide range of workpiece materials, including metal alloys, ceramics, and amorphous materials and composite materials.
Ultrasonic assisted system is a new technology of processing method which could enhance the milling and drilling performance through high frequency micro vibrations. Ultrasonic assisted system is constituted of 3 parts: ultrasonic generator, ultrasonic transducer and ultrasonic horn.
Through the ultrasonic digital generator, the ultrasonic tool holder can produce continuous high-intensity vibration impact of 20KHZ-50KHZ (ultrasonic frequency), which drives the tool (turning tool, milling tool, touch) to impact the workpiece. So that the local stress of the workpiece far exceeds the limit of brittle fracture of the material, so that the material is locally broken and removed.
The introduction of ultrasonic vibration changes the time-space relationship, contact state and action mechanism between the tool and the workpiece, thus changing the machining mechanism.
The introduction of ultrasonic vibration can reduce the friction between the tool and the workpiece, reduce the contact time between the tool and the workpiece, so as to effectively improve the material removal rate, reduce the cutting force, reduce the cutting heat, reduce the tool wear, and improve the machining accuracy and quality.
Working frequency | 20 KHz |
Power | 500w |
Product mode | BT/ ISO/ HSK/ CAT series drilling machine handle |
Amplitude | 10um or more(adjustable) |
Speed | 20000 r/min |
Matching tool | Carbide drilling head Φ2-Φ10mm |
Ultrasonic machining is mainly used for drilling (including round holes, special-shaped holes and curved holes) of various hard and brittle materials, such as glass, quartz, ceramics, silicon, germanium, ferrite, gemstones and jade, cutting, slotting, nesting, engraving, deburring of batch small parts, polishing of mold surface and grinding wheel dressing.
Corundum abrasive is used for ultrasonic processing of plastic materials, silicon carbide abrasive is used for brittle materials, boron carbide abrasive is used for processing of cemented carbide, and diamond powder abrasive is used for processing of diamond. Therefore, it is widely used in high-end electronic products, such as smart phones, tablet computers, smart TVs, handheld devices and liquid crystal displays (LCD).
1. Facilitate the discovery of new substances.
2. Will not change the chemical structure of the multi-mentioned ingredients.
3. Do not use or use less extractant to reduce the pollution of extractant.
4. The technology is simple, which can increase the production speed, reduce the production cost of the enterprise, and increase the economic effect.
Address: No.30 DATANG VILLAGE FUYANG DISTRICT HANGZHOU CITY ZHEJIANG PROVINCE CHINA
Email: info@shengpaigroup.com
Tel: 0086-571-63127797
Mobile: 0086-15888033040
0086-15355441892
NEWSLETTER
Signup to be the first to know about discounts and new product releases.
Hangzhou Shengpai Technology Co.,Ltd © 2020 - ALL RIGHTS RESERVED